New WiMax Chipset for Mobile Devices
By CXOtoday Staff
Mumbai, Jun 24, 2008

Fujitsu Microelectronics Asia has launched a new mobile WiMAX chipset optimized for mobile WiMAX devices such as smart phones and PDAs.

It is designed to fit in the 12x12mm WiMAX module. The standby current - which has a direct impact on battery life - will not exceed 0.5mA, facilitating the development of more competitive mobile WiMAX terminals.

Makoto Awaga, GM (mobile solution business group) of Fujitsu Microelectronics Japan said, "This highly integrated WiMAX chipset features the low power and small form factor essential to the development of attractive mobile WiMAX terminal products. Fujitsu Microelectronics has assumed a global leadership position in WiMAX business development, and we have been working with different module vendors to meet market demand."

With a baseband LSI, MB86K22; an RF LSI, MB86K52; and a power management LSI, MB39C316, the shipment of these chipsets will start in August 2008. MB86K22 is a fully integrated baseband LSI built using Fujitsu Microelectronics 65nm advanced CMOS low-leakage process technology. Also, MB86K52 is an RF LSI built using CMOS process technology, which supports 2.3GHz, 2.5GHz, and 3.5GHz, covering almost all the frequencies set by the WiMAX Forum. While MB39C316 power management LSI eliminates all the complex and time-consuming power management requirements by adopting one-cell battery.

The initial service will be provided through PC-based mobile broadband access, with simultaneous development of portable devices, smart phones, PDAs, portable games, and navigation systems supporting the Mobile WiMAX technology. The deployment will begin in the United States, Europe, and Taiwan this year, and in Japan next year.


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