Hitachi's Small RFID IC Chip

by CXOtoday Staff    Feb 07, 2006

Hitachi, Ltd. has announced that it has developed and verified operation of the thinnest and smallest chip in the world.

A smaller version of the 0.4 x 0.4 mm ‘” -Chip’, the new product is 0.15 x 0.15 millimeter (mm), 7.5-micrometer (” m) thick contactless IC chip.

With SOI technology the distance between each circuit element was reduced which has an insulating layer in the substrate. Compared to the 0.3 x 0.3 mm, 60″ m thick IC chip, surface area is reduced to a quarter of the original size. Developments in thin chip fabrication technology have also enabled the chip to be reduced to one-eighth thickness of the 0.3mm IC chip. Decreasing size increases the number of chips, which can be fabricated on a single wafer.

The ” -Chip uses an external antenna to receive radio waves and transforms it to energy to wirelessly transmit a 128 bit (1038) unique ID number. As the data is written during the fabrication process using ROM, it is impossible to rewrite the data. By taking advantage of the merits of compactness, high authenticity and contactless communication, and combining it with Internet technology, the ” -Chip may be utilized in a broad range of applications such as security, transportation, amusement, traceability and logistics.

The enhanced compactness and thinness of this new chip has further broadened the range of possible applications, including securities like gift certificates and a large variety of certificates. Further, as with the 0.3mm IC chip, the new chip has a double-surface electrode, and therefore despite its even smaller size, connection with the external antenna can be easily achieved, and high productivity maintained.