NXP Semiconductors, SRV Telecom Collaborate

by CXOtoday Staff    Dec 19, 2006

NXP Semiconductors and SRV Telecom Pvt. Ltd. have announced a collaboration to design, develop and manufacture digitally Enhanced Cordless Telephones (DECT) in India.

These phones will target the home as well as enterprise markets. The company adds that it will provide its proven three-chip DECT chipsets, including an RF amplifier (RF-PA), a transceiver (TX-RX) and a baseband IC designed on an ARM7 core. SRV Telecom will design, manufacture and market the phones in India.

Commenting on the collaboration between the two companies, E.K. Surendran, managing director, SRV Telecom adds, “We believe these phones will provide the next experience in sound quality and usability to fixed line telephone connections.”

SRV has put in place a design team and plans to meet expected demand for phones by investing in a new manufacturing facility in Bangalore. The facility is due to open before the end of April 2007 and will have an annual production capacity of around 2,000,000 phones when fully operational. Once in full production, SRV will investigate opportunities for exporting phones to markets around the world.

Asked about NXP’s role, Rajeev Mehtani, VP & MD, NXP, India responds, “By participating in such initiatives, we intend to further contribute to the local design and manufacturing ecosystem in the booming telecommunications industry. We are pleased to enable operators to provide the more than 40 million fixed line subscribers in India with a better handset experience.”

He further adds, “NXP Semiconductors’ DECT phone chipsets offer a combination of superior voice quality and low power consumption with the convenience and freedom of movement offered by mobile phones, in the home or office environment.”