Samsung Has Maximum Installed Wafer Capacity: Study

by CXOtoday News Desk    Jan 10, 2014

samsung

IC Insights has provided a ranking of the industry’s 10 largest IC manufacturers in terms of installed capacity. As of December 2013, Samsung Electronics had the most installed wafer capacity with nearly 1.9 million 200mm-equivalent wafers per month, according to IC Insights. That represented 12.6% of the world’s total capacity and most of it used for the fabrication of DRAM and flash memory devices. TSMC with about 1.5 million wafers per month capacity, or 10.0% of total worldwide capacity held the second position, following Micron Technology, Toshiba-SanDisk and Intel.

With the addition of the Elpida and Rexchip fabs as well as the extra Inotera capacity in 2013, Micron became the third-largest wafer capacity holder in the world in 2013 with nearly 1.4 million 200mm-equivalent wafers per month, or 9.3% of total worldwide capacity, states IC Insights. At the end of 2012, Micron had the sixth-largest amount of wafer capacity.

The fourth-largest capacity holder at the end of 2013 was Toshiba with a little under 1.2 million in monthly wafer capacity representing 8% of total worldwide capacity, including a substantial amount of flash memory capacity for joint-investor SanDisk, IC Insights indicated.

Rounding out the top six companies was Intel with 6.5% of total worldwide capacity, IC Insights said. Just two years ago in 2011, Intel was the third-largest capacity leader, but in early 2012 the company reduced its ownership position in IM Flash as well as its wafer output share from its joint venture with Micron.

The report mentions the three largest pure-play foundries - TSMC, Globalfoundries, and UMC - have held about 80% of the worldwide pure-play foundry market since 2010. Moreover, they had a combined capacity of about 2.5 million wafers per month as of December 2013, representing about 17% of the total fab capacity in the world.

The combined capacity of the top-5 leaders accounted for 47% of total worldwide capacity in December 2013. At the same time, just over two-thirds of the world’s capacity was represented by the combined capacity of the top-10 leaders, while the top 15 accounted for 76% and the top 25, 85%, of worldwide installed IC capacity in December 2013. The report noted that the shares of these groups have each increased significantly since 2009

 

IC Insights believes that the capacity shares of the top 20 leaders will continue to increase over the next several years improved competitiveness, and a greater demand from mid- to small-size companies who are shifting from in-house IC fabrication to using third-party foundries.