@3D Stacking
IBM Stacks Chips to Save Power and Time
by Sonal Desai    Apr 17, 2007
Category : News & Analysis
Technology : Infrastructure
IBM has devised a three- dimensional semiconductor design, where different functions of a chip are stacked one on top of the other, instead of side by side. The technology is called 3D Stacking. In 2D designs, the chips sit net to one...